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  • Equipment
    • Lithography
    • Physical Vapor Deposition
    • PECVD & ALD
    • Plasma Etching
    • Thermal Process
    • Thin Film Measurement
    • Focused Ion Beam
    • Packaging tools
  • Team
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oxidation

oxidation furnance

TYSTAR TYTAN 4600


Four distinct tubes

Up to 1100 degrees C operation

Up to 25 wafes or samples

Wafers of either 150mm or 100mm in diameter

Small pieces have dedicated quatzware


Tube 1: CMOS Oxide, Online Oxidation Calulator 

Tube 2: General Oxide, Online Oxidation Calculator

Tube 3: Diffusion

Tube 4: Anneal

Rapid Thermal Process

rtp

Solaris RTP 1


Up to  to 4" in diameter substrate capability


Max temperature: 1100 °C

Gases available: N2, O2

RTP

IES RTP


ONLY for samples that are CMOS compatible


Up to 200 mm in diameter capability


Gases available: Nitrogen, Oxygen, 5%H2/N2


Temperature limit 1200 degree C for 3 minutes

oven

VAcuum oven

EQ-DZF-6050-HT/500


Up to 500 degree C baking

Under Vacuum of 2e-2 mBar, or Nitrogen  or air for sustained periods

VAcuum oven

Oven 2

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LCN-Cleanroom

Hours

Mon

09:00 – 17:00

Tue

09:00 – 17:00

Wed

09:00 – 17:00

Thu

09:00 – 17:00

Fri

09:00 – 17:00

Sat

Closed

Sun

Closed

Got any questions?

If you have any questions regarding our laboratory, get in touch with a member of our team.

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Copyright © 2024 LCN-Cleanroom - All Rights Reserved.

  • Home
  • Lithography
  • Physical Vapor Deposition
  • PECVD & ALD
  • Plasma Etching
  • Thermal Process
  • Thin Film Measurement
  • Team
  • Contact

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