LCN-Cleanroom
LCN-Cleanroom
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    • Lithography
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    • Home
    • Equipment
      • Lithography
      • Physical Vapor Deposition
      • PECVD & ALD
      • Plasma Etching
      • Thermal Process
      • Thin Film Measurement
      • Focused Ion Beam
      • Packaging tools
    • Team
    • Contact
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  • Home
  • Equipment
    • Lithography
    • Physical Vapor Deposition
    • PECVD & ALD
    • Plasma Etching
    • Thermal Process
    • Thin Film Measurement
    • Focused Ion Beam
    • Packaging tools
  • Team
  • Contact

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Sputter coating

Sputter coater

SVS 6000

 

Four 2” sources

Ion Gun System for sample cleaning

Max sample size 3”

Metals include Nb, Au

Sputter coater

K J Lesker PVD 75


 Three Magnetron sputter sources 3 inches in diameter. 

One of which can be selected in sequence. 

RF or DC power to sputter insulating or conductive materials.  The substrate cleaning  via RF Bias. 

Evaporation

E-BEAM evaporator

A500


 4 pocket Temescal Electron Beam gun

2 thermal sources

Max sample size 6”

Metals include Ti, Au, Mo, Pt

THERMAL EVAPORATOR

A306 Metal box


Four independent source positions allowing multiple layers to be deposited without breaking vacuum. 

The maximum sample size is 200mm in diameter, or multiple smaller pieces. 

THERMAL EVAPORATOR

A306 Bell Jar


Four independent source positions allowing multiple layers to be deposited without breaking vacuum.  The maximum sample size is 200mm diameter, or multiple smaller pieces. 

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LCN-Cleanroom

Hours

Mon

09:00 – 17:00

Tue

09:00 – 17:00

Wed

09:00 – 17:00

Thu

09:00 – 17:00

Fri

09:00 – 17:00

Sat

Closed

Sun

Closed

Got any questions?

If you have any questions regarding our laboratory, get in touch with a member of our team.

Contact us

Copyright © 2024 LCN-Cleanroom - All Rights Reserved.

  • Home
  • Lithography
  • Physical Vapor Deposition
  • PECVD & ALD
  • Plasma Etching
  • Thermal Process
  • Thin Film Measurement
  • Team
  • Contact

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