PLASMA ETCHing

STS DRIE

Si deep etch using the Bosch process 

6" capability

Anisotropic etch profile

Gases available: 

O2, Ar, SF6, CF4, C4F8

STS SRIE

ICP RIE for Si, Al, GaAs, InP, TiSi2 and diamond

6" in diameter capability

Gases available

CH4, O2, H2, Ar, Cl, BCl3, SF6, N2

Oxford Plasma Pro NGP80

Platen: Graphite 300 mm in diameter

RF power: 13.65 MHz 300 W

Gases: SF6, CHF3, O2, H2, CH4, Ar

Optimised film etching: Si, Silicon Oxide, Silicon Nitride, Niobium and similar films

Tepla 400 plasma Cleaner

Microwave plasma

Up to 300mm diameter sample

Gases O2 & 3%O2 in He

Pre Bond Cleaning, Die pad cleaning, Large parts cleaning

Diener Plasma Barrel Asher

Removing organic materials: photoresist strip, descum,  pre-spin cleaning

Gases: O2, Ar and air 

RF generator, 13.56 MHz, 300 W 

Quartzware available as sample holders