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Wire bonder
Gold wedge bonder 4523
Suitable edges and clamps are obtained
Set up as a 38 degree wedge bonder
Fit with 25 µm diameter gold wire
Heated stage
Wire bonder
Aluminium wedge bonder 4123
Fit with 25 µm diameter aluminium wire
Wafer saw
Disco DAD3230
Sawing flat substrates up to 150mm in diameter
Interchangeable blade to suit the material being cut
Common materials for dicing
Silicon
Quartz
Glass
Sapphire
Wafer scriber
Karl Suss scriber
Scribe Gallium Arsenide samples
Low force diamond stylus setup