Lithography

Elionix 100 kV

• Sample sizes range from 3X3 mm up to full 6" wafers. 
• Linewidth resolution:  6nm

Heidelberg DWL66

Write head                        2 mm               10 mm

Smallest feature (nm) 400-600           950-1000

Speed                                 5mm2/sec     20x faster than 2mm write head

• laser wavelength 375nm, 70mW.
• Four cameras- micro and macro cameras on the front and back of sample.
• Back-side alignment sample holder for 4" sample.
•  filtered flow box contains internal heating system- temperature stable at +/-0.1deg C. T set at 22.7deg C (doors closed).
•  air levelled granite table (against vibrations)
•  positioning interferometer accuracy: 10 nm

Raith 150

• Sample sizes range from 3X3 mm up to full 4" wafers. 
• Linewidth resolution: 20nm

Quintel mask aligner

• 6" capability
• resolution 1 um minimum feature 
• Infra red back side alignment.
• Soft and vacuum contact modes.
• UV300 optics for 365 nm sensitive photoresists.

MJB 3 Kall Suss

•  resolution 1 um minimum feature 
• Masks from 2" to 4" square, 0.06" thick.
• Soft and hard contact modes.
• UV 300 optics for 365 nm photoresists.